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C-TECH晶振解答你關于SAW濾波器的十萬個為什么
C-TECH是一家領先的制造和開發公司，自1997年成立以來，主要研發生產銷售SAW濾波器業務，至今已超過20年。C-TECH采用優異的原料，先進的技術設備生產，產品品質和經驗絲毫不輸同行。C-TECH晶振正在開發一種半導體工藝，可以獨立完成制造和組裝。憑借積累的技術和知識，我們提供定制開發根據客戶要求的規格。
基于ISO 9001和ISO 14001的可靠性，聲表面波濾波器開發和生產本身就是生產CDMA / LTE / 5G移動中繼、國防工業、基站、收音機、無線尋呼機、無線麥克風、調頻、DMB、GPS、WiFi、高通、藍牙、IOT等正在被應用到無線業務的各個領域。下面C-TECH對自己精心鉆研的產品SAW FILTER聲表面濾波器進行詳細介紹。
聲表面波濾波器（表面聲波）是使用表面聲波控制信號頻率分量和相位分量，以消除相鄰信道信號，它是一個帶通濾波器（BPF），對接收信道信號進行整形。
SAW濾波器的工作原理
當梳狀電極(IDT)形成在壓電基板的兩側并且電信號施加到輸入端時，沿襯底表面傳播的表面聲波(SAW)由壓電效應產生，并在輸出端轉換回電信號。這些SAW器件的頻率特性由IDT電極的幾何結構決定。
SAW濾波器制造工藝
| Process | Equipment | Description |
|---|---|---|
| WAFER Cleaning | Wet Station Rinse & Drier | Process to remove foreign substances causing short circuit defects on the wafer surface before AI deposition and to increase adhesion between the wafer surface and AL |
| Sputtering | Sputter T/Profiler | Process for depositing AL on wafer surface to desired height |
| P.R Coating | Coater | Process for applying photo Resist on AL |
| Exposing | Aligner Stepper | First step process of pattern formation by irradiating UV on PR through MASK |
| Developing | Developer Scope | Process of removing UV irradiated PR for AL Etching after Exposing |
| Etching | Wet Station Rinse & Drier | Process of implementing the final pattern by removing the AL in each selected manner |
| Stripping | Wet Station Rinse & Drier | Process for removing PR that protects AL patterns |
| Auto Probing | Auto Prober Dry Oven | Process for determining good and bad products by measuring metod before puttiong the products divided into cells of the wafer into assembly |
Assembl
| Process | Equipment | Description |
|---|---|---|
| Absorber Coating | Screen Printer Dry Oven | Process of applying an absorber to each cell to improve the characteristics of the output to the measuring device |
| Dicing | Tape Mounter Dicing SAW Cleaner | Process of cutting each cell of the wafer based on the Dicing Line |
| Die Bonding | Die bonder Epoxy Dispenser UV,Dry Oven | Process of bonding base and chip by applying epoxy |
| Wire Bonding | Wire Bonder | The Process of connecting the terminal of the BASE and the PAD of the CHIP to transmit an electrical signal to the AL wire |
| Can Sealing | Spot Welder Seam Sealer Dry Oven | Welding Process using Lid & Cap to protect the chip |
| Marking | Laser Maker | Process of laser marking the product’s unique model name and data code |
| Testing | Network Analyzer | Process for final inspection of product defects |
| Q.C | Network Analyzer | Process of sampling and inspection of mixed or defective products |
| Packing | Tape & Reel | Q.C process for packaging completed products |
| Shipping | Shipment of all process and packaged products |
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